Display device

ABSTRACT

A display device including a display panel including a flat area including a first display area and a first peripheral area adjacent to the first display area and a bending area including a second display area and a second peripheral area adjacent to the second display area, and an input sensing unit on the display panel. The input sensing unit includes first touch sensors having a mesh shape, extending in a first direction parallel to a bending axis of the bending area, and arranged in a second direction crossing the first direction, second touch sensors having a mesh shape, extending in the second direction, and arranged in the first direction, first connection electrodes respectively connected to ends of the first touch sensors, second connection electrodes respectively connected to ends of the second touch sensors, and touch signal lines connected to the first connection electrodes and the second connection electrodes.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a Continuation of U.S. patent application Ser. No.17/343,664, filed on Jun. 9, 2021, which is a Continuation of U.S.patent application Ser. No. 16/544,041, filed on Aug. 19, 2019, whichissued as U.S. Pat. No. 11,036,340, which is a Continuation of U.S.patent application Ser. No. 15/653,202, filed Jul. 18, 2017, whichissued as U.S. Pat. No. 10,409,433, and which claims priority from andthe benefit of Korean Patent Application No. 10-2016-0097484, filed onJul. 29, 2016, each of which is hereby incorporated by reference for allpurposes as if fully set forth herein.

BACKGROUND Field

Exemplary embodiments of the invention relate to a display device. Moreparticularly, exemplary embodiments of the invention relate to a displaydevice including an input sensing unit.

Discussion of the Background

Electronic devices, such as a smart phone, a tablet computer, a notebookcomputer, a smart television, etc., have recently been developed. Theelectronic devices include a display device to provide information.

In recent years, display devices have included a touch sensing functionfor interaction with a user, in addition to a function of displaying animage through a display panel. The touch sensing function is used tocheck whether an object touches a screen and to obtain a touchcoordinate in accordance with a user's finger or a touch pen makingcontact with or approaching the screen. The display device receives animage signal on the basis of the touch coordinate.

The above information disclosed in this Background section is only forenhancement of understanding of the background of the inventive concept,and, therefore, it may contain information that does not form the priorart that is already known in this country to a person of ordinary skillin the art.

SUMMARY

Exemplary embodiments of the invention provide a display device capableof preventing a signal line from fracturing in a bending area.

Additional aspects will be set forth in the detailed description whichfollows, and, in part, will be apparent from the disclosure, or may belearned by practice of the inventive concept.

An exemplary embodiment of the invention discloses a display deviceincluding a display panel and an input sensing unit disposed on thedisplay panel. The display panel includes a flat area including a firstdisplay area and a first peripheral area adjacent to the first displayarea, and a bending area including a second display area and a secondperipheral area adjacent to the second display area. The input sensingunit includes: a plurality of first touch sensors having a mesh shape,extending in a first direction parallel to a bending axis of the bendingarea, and arranged in a second direction crossing the first direction; aplurality of second touch sensors having a mesh shape, extending in thesecond direction, and arranged in the first direction; first connectionelectrodes respectively connected to ends of the first touch sensors;second connection electrodes respectively connected to ends of thesecond touch sensors; and a plurality of touch signal lines connected tothe first connection electrodes and the second connection electrodes. Atleast one first connection electrode disposed in the bending area amongthe first connection electrodes includes a center portion and oppositeedge portions, and one edge portion of the opposite edge portionsincludes a first edge and a second edge inclined with respect to thebending axis.

An exemplary embodiment of the invention also discloses a display deviceincluding a display panel and an input sensing unit disposed on thedisplay panel. The display panel includes a flat area including a firstdisplay area and a first peripheral area adjacent to the first displayarea, and a bending area including a second display area and a secondperipheral area adjacent to the second display area. The input sensingunit includes: a plurality of first touch sensors having a mesh shape,extending in a first direction parallel to a bending axis of the bendingarea, and arranged in a second direction crossing the first direction; aplurality of second touch sensors having a mesh shape, extending in thesecond direction, and arranged in the first direction; and a pluralityof touch signal lines applying an electrical signal to the first touchsensors and the second touch sensors. The touch signal line disposed inthe bending area among the touch signal lines includes an inclinationportion inclined with the bending axis and a parallel portion parallelto the bending axis.

According to the above, first and second ends of a signal line disposedin the bending area and connected to the touch sensor may have a slopewith respect to an axis perpendicular to the bending axis. That is,since the first end and the second end of the touch signal line are notperpendicular to the bending axis, the stress applied to the touchsignal line may be reduced. As a result, the touch signal line may beprevented from being damaged in the bending area.

The foregoing general description and the following detailed descriptionare exemplary and explanatory and are intended to provide furtherexplanation of the claimed subject matter.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the inventive concept, and are incorporated in andconstitute a part of this specification, illustrate exemplaryembodiments of the inventive concept, and, together with thedescription, serve to explain principles of the inventive concept.

FIG. 1A is a perspective view showing a display device according to anexemplary embodiment of the invention.

FIG. 1B is a perspective view showing a display device according to anexemplary embodiment of the invention.

FIG. 2 is a cross-sectional view showing a display device shown in FIG.1.

FIG. 3A is a plan view showing a display panel according to an exemplaryembodiment of the invention.

FIG. 3B is a cross-sectional view showing a display module according toan exemplary embodiment of the invention.

FIG. 4A is an equivalent circuit diagram showing a pixel according to anexemplary embodiment of the invention.

FIG. 4B and FIG. 4C are partial cross-sectional views showing a displaypanel according to an exemplary embodiment of the invention.

FIG. 5A, FIG. 5B, and FIG. 5C are cross-sectional views showing a thinfilm encapsulation layer according to an exemplary embodiment of theinvention.

FIG. 6A is a cross-sectional view showing an input sensing unitaccording to an exemplary embodiment of the invention.

FIG. 6B, FIG. 6C, FIG. 6D, and FIG. 6E are plan views showing an inputsensing unit according to an exemplary embodiment of the invention.

FIG. 7A is an enlarged view showing an area AA shown in FIG. 6Eaccording to an exemplary embodiment of the invention.

FIG. 7B is an enlarged view showing a sensor pattern shown in FIG. 7Aaccording to an exemplary embodiment of the invention.

FIG. 7C is an enlarged view showing an area BB shown in FIG. 6Eaccording to an exemplary embodiment of the invention.

FIG. 7D is an enlarged view showing an area AX1 shown in FIG. 7C.

FIG. 7E is an enlarged view showing an area AX2 shown in FIG. 7Caccording to an exemplary embodiment of the invention.

FIG. 7F is an enlarged view showing an area AX2 shown in FIG. 7Caccording to an exemplary embodiment of the invention.

FIG. 7G and FIG. 7H are enlarged views showing an area BB shown in FIG.6E according to an exemplary embodiment of the invention.

FIG. 8A is a plan view showing an input sensing unit according toanother exemplary embodiment of the present disclosure.

FIG. 8B is an enlarged view showing an area CC shown in FIG. 8Aaccording to an exemplary embodiment of the invention.

FIG. 9 is a plan view showing an input sensing unit according to anotherexemplary embodiment of the invention.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various exemplary embodiments. It is apparent, however,that various exemplary embodiments may be practiced without thesespecific details or with one or more equivalent arrangements. In otherinstances, well-known structures and devices are shown in block diagramform in order to avoid unnecessarily obscuring various exemplaryembodiments.

In the accompanying figures, the size and relative sizes of layers,films, panels, regions, etc., may be exaggerated for clarity anddescriptive purposes. Also, like reference numerals denote likeelements.

When an element or layer is referred to as being “on,” “connected to,”or “coupled to” another element or layer, it may be directly on,connected to, or coupled to the other element or layer or interveningelements or layers may be present. When, however, an element or layer isreferred to as being “directly on,” “directly connected to,” or“directly coupled to” another element or layer, there are no interveningelements or layers present. For the purposes of this disclosure, “atleast one of X, Y, and Z” and “at least one selected from the groupconsisting of X, Y, and Z” may be construed as X only, Y only, Z only,or any combination of two or more of X, Y, and Z, such as, for instance,XYZ, XYY, YZ, and ZZ. Like numbers refer to like elements throughout. Asused herein, the term “and/or” includes any and all combinations of oneor more of the associated listed items.

Although the terms first, second, etc. may be used herein to describevarious elements, components, regions, layers, and/or sections, theseelements, components, regions, layers, and/or sections should not belimited by these terms. These terms are used to distinguish one element,component, region, layer, and/or section from another element,component, region, layer, and/or section. Thus, a first element,component, region, layer, and/or section discussed below could be termeda second element, component, region, layer, and/or section withoutdeparting from the teachings of the present disclosure.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper,” and the like, may be used herein for descriptive purposes, and,thereby, to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the drawings. Spatiallyrelative terms are intended to encompass different orientations of anapparatus in use, operation, and/or manufacture in addition to theorientation depicted in the drawings. For example, if the apparatus inthe drawings is turned over, elements described as “below” or “beneath”other elements or features would then be oriented “above” the otherelements or features. Thus, the exemplary term “below” can encompassboth an orientation of above and below. Furthermore, the apparatus maybe otherwise oriented (e.g., rotated 90 degrees or at otherorientations), and, as such, the spatially relative descriptors usedherein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises,” “comprising,” “includes,” and/or “including,”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, elements, components, and/orgroups thereof, but do not preclude the presence or addition of one ormore other features, integers, steps, operations, elements, components,and/or groups thereof.

Various exemplary embodiments are described herein with reference tosectional illustrations that are schematic illustrations of idealizedexemplary embodiments and/or intermediate structures. As such,variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, exemplary embodiments disclosed herein should not beconstrued as limited to the particular illustrated shapes of regions,but are to include deviations in shapes that result from, for instance,manufacturing. The regions illustrated in the drawings are schematic innature and their shapes are not intended to illustrate the actual shapeof a region of a device and are not intended to be limiting.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and will not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

FIG. 1A is a perspective view showing a display device DD according toan exemplary embodiment of the present disclosure. FIG. 1B is aperspective view showing a display device DD according to an exemplaryembodiment of the present disclosure.

FIGS. 1A and 1B show the display device DD applicable to a smart phoneas a representative example. The flexible display device DD according tothe present exemplary embodiment may be applied to electronic devices,such as a television set, a personal computer, a notebook computer, acar navigation unit, a game unit, a sound electronic device, a smartwatch, a camera, etc., but it should not be limited thereto.

Referring to FIG. 1A, the display device DD includes a flat area NBA anda bending area BA, which are distinguished from each other with respectto a bending axis BX. The flat area NBA includes a first display surfaceIS1, and the bending area BA includes a second display surface IS2.

In detail, the flat area NBA includes a first display area DD-DA1 of thefirst display surface IS1 and a first peripheral area DD-NDA1 adjacentto the first display area DD-DA1. The bending area BA includes a seconddisplay area DD-DA2 of the second display surface IS2 and a secondperipheral area DD-NDA2 adjacent to the second display area DD-DA2.

The first display area DD-DA1 is distinguished from the second displayarea DD-DA2 with respect to the bending axis BX. The first peripheralarea DD-NDA1 is distinguished from the second peripheral area DD-NDA2with respect to the bending axis BX. An image IM is displayed throughthe first display area DD-DA1 and the second display area DD-DA2.

In the flat area NBA, the first display surface IS1, in which the imageIM is displayed, is substantially parallel to a surface defined by afirst direction DR1 and a second direction DR2. A normal line directionof the display surface IS, i.e., a thickness direction of the displaydevice DD, indicates a third direction DR3. In each member, a frontsurface (or an upper surface) is distinguished from a rear surface (or alower surface) by the third direction DR3. However, the first to thirddirections DR1 to DR3 are relative to each other, and thus, the first tothird directions DR1 to DR3 may be changed to any other directions.Hereinafter, first to third directions correspond to directionsrespectively indicated by the first to third directions DR1 to DR3, andthus, the first to third directions are assigned with the same referencenumerals as those of the first to third directions DR1 to DR3.

Referring to FIG. 1B, the display device DD may include one flat areaNBA and first and second bending areas BA1 and BA2 spaced apart fromeach other such that the flat area NBA is disposed between the first andsecond bending areas BA1 and BA2. The first and second bending areas BA1and BA2 are bent from opposite ends of the flat area NBA in the seconddirection DR2.

Hereinafter, the display device DD configured to include one bendingarea BA, as shown in FIG. 1A, will be described in detail as arepresentative example.

FIG. 2 is a cross-sectional view showing the display device DD shown inFIG. 1.

Referring to FIG. 2, the display device DD includes a protective filmPM, a display module DM, an optical member LM, a window WM, a firstadhesive member AM1, a second adhesive member AM2, and a third adhesivemember AM3. Each of the protective film PM, the display module DM, theoptical member LM, the window WM, the first adhesive member AM1, thesecond adhesive member AM2, and the third adhesive member AM3 includesthe flat area NBA and the bending area BA.

The display module DM is disposed between the protective film PM and theoptical member LM. The optical member LM is disposed between the displaymodule DM and the window WM. The first adhesive member AM1 couples thedisplay module DM and the protective film PM, the second adhesive memberAM2 couples the display module DM and the optical member LM, and thethird adhesive member AM3 couples the optical member LM and the windowWM.

The protective film PM protects the display module DM. The protectivefilm PM includes a first outer surface OS-L exposed to the outside andan adhesive surface adhered to the first adhesive member AM1. Theprotective film PM prevents external moisture from entering the displaymodule DM and absorbs external impacts.

The protective film PM may include a plastic film as a base substrate.The protective film PM may include the plastic film including oneselected from the groups consisting of polyethersulfone (PES),polyacrylate, polyetherimide (PEI), polyethylenenaphthalate (PEN),polyethyleneterephthalate (PET), polyphenylene sulfide (PPS),polyarylate, polyimide (PI), polycarbonate (PC), poly(aryleneethersulfone), and a mixture thereof.

The material of the protective film PM may include a mixed material ofan organic material and an inorganic material without being limited tothe plastic resins. The protective film PM includes a porous organiclayer and an inorganic material filled in pores of the organic layer.The protective film PM may further include a functional layer formed inthe plastic film. The functional layer includes a resin layer. Thefunctional layer is formed by a coating method. In the present exemplaryembodiment, the protective film PM may be omitted.

The window WM protects the display module DM from the external impactsand provides an input surface to the user. The window WM provides asecond outer surface OS-U exposed to the outside and an adhesive surfaceadhered to the third adhesive member AM3. The display surface IS shownin FIGS. 1A and 1B may be the second outer surface OS-U.

The window WM may include a plastic film. The window WM may have amulti-layer structure. The window WM may have the multi-layer structureof a glass substrate, a plastic film, or a plastic substrate. The windowWM may further include a bezel pattern. The multi-layer structure of thewindow WM may be formed through consecutive processes or an adhesiveprocess using an adhesive.

The optical member LM reduces a reflectance of an external light. Theoptical member LM includes at least a polarizing film. The opticalmember LM further includes a retardation film. In the present exemplaryembodiment, the optical member LM may be omitted.

The display module DM includes a display panel DP and an input sensingunit TS. The input sensing unit TS is directly disposed on the displaypanel DP. In the following descriptions, the expression “a firstcomponent is directly disposed on a second component” means that thefirst and second components are formed through consecutive processeswithout being attached to each other by using a separate adhesive layer.

The organic light emitting display panel DP generates the image WI(refer to FIG. 1A) corresponding to image data input thereto. Theorganic light emitting display panel DP includes a first display panelsurface BS1-L and a second display panel surface BS1-U facing the firstdisplay panel surface BS1-L in the thickness direction DR3. In thepresent exemplary embodiment, the organic light emitting display panelDP will be described as a representative example, but the display panelDP should not be limited thereto or thereby.

The input sensing unit TS obtains coordinate information of an externalinput. The input sensing unit TS senses the external input in anelectrostatic capacitive manner.

Although not shown in the figures, the display module DM according tothe present exemplary embodiment may further include an anti-reflectionlayer. The anti-reflection layer may include a stack structure of acolor filter or a conductive layer/an insulating layer/a conductivelayer. The anti-reflection layer absorbs or polarizes the light from theoutside thereof to reduce the reflectance of the external light. Theanti-reflection layer may replace the function of the optical member LM.

Each of the first, second, and third adhesive members AM1, AM2, and AM3may be, but not limited to, an organic adhesive layer, such as anoptically clear adhesive film (OCA), an optically clear resin (OCR), ora pressure sensitive adhesive film (PSA). The organic adhesive layer mayinclude a polyurethane-based adhesive material, a polyacryl-basedadhesive material, a polyester-based adhesive material, a polyepoxy-based adhesive material, or a polyvinyl acetate-based adhesivematerial.

Although not shown in the figures, the display device DD may furtherinclude a frame structure supporting the functional layers to maintainthe state shown in FIGS. 1A and 1B. The frame structure may have a jointstructure or a hinge structure.

FIG. 3A is a plan view showing a display panel according to an exemplaryembodiment of the present disclosure. FIG. 3B is a cross-sectional viewshowing a display module according to an exemplary embodiment of thepresent disclosure.

Referring to FIG. 3A, the organic light emitting display panel DPincludes a display area DA and a peripheral area NDA when viewed in aplan view. The display area DA and the peripheral area NDA of theorganic light emitting display panel DP respectively correspond to thedisplay area DD-DA and the peripheral area DD-NDA of the display deviceDD. The display area DA and the peripheral area NDA of the organic lightemitting display panel DP are not required to be identical to thedisplay area DD-DA and the peripheral area DD-NDA of the display deviceDD, and the display area DA and the peripheral area NDA of the organiclight emitting display panel DP may be changed in accordance with thestructure and design of the organic light emitting display panel DP.

The organic light emitting display panel DP includes a plurality of gatelines GL, a plurality of data lines DL, a plurality of light emittinglines EL, a plurality of first and second initialization lines SL-Vint1and SL-Vint2, a plurality of first power lines SL-VDD1 and SL-VDD2, asecond power supply line E-VSS, a plurality of pad parts PD, a pluralityof signal connection lines SCL, a gate-light emission driving part GDC,and a plurality of pixels PX.

An area in which the pixels PX are arranged is referred to as thedisplay area DA. In the present exemplary embodiment, the peripheralarea NDA is defined along an edge of the display area DA.

Each of the gate lines GL extends in the second direction DR2 and isconnected to a corresponding pixel of the pixels PX, and each of thedata lines DL extends in the first direction DR1 and is connected to acorresponding pixel of the pixels PX. Each of the light emitting linesEL extends in the second direction DR2 and is connected to acorresponding pixel of the pixels PX.

The first power lines SL-VDD1 and SL-VDD2 include a plurality of firstsub-power lines SL-VDD1 extending in the first direction DR1 and aplurality of second sub-power lines SL-VDD2 extending in the seconddirection DR2 and connected to the first sub-power lines SL-VDD1. Thesecond sub-power lines SL-VDD2 are connected to the pixels PX, and thefirst and second sub-power lines SL-VDD1 and SL-VDD2 receive a firstvoltage. The first voltage may be referred to as an “anode voltage”.

The first initialization lines SL-Vint1 extend in the first directionDR1, and the second initialization lines SL-Vint2 extend in the seconddirection DR2 and are connected to the first initialization linesSL-Vint1. The second initialization lines SL-Vint2 are connected to thepixels and receive an initialization voltage.

The gate-light emission driving part GDC is disposed at one side of theperipheral area NDA and connected to the gate lines GL and the lightemitting lines EL. The gate-light emitting driving part GDC receives acontrol signal through a corresponding first signal connection lineamong the signal connection lines SCL and generates gate signals andlight emitting signals in response to the received control signal. Oneend of the first signal connection line is connected to the gate-lightemission driving part GDC, and the other end of the first signalconnection line is connected to the pad parts PD. The gate lines GLreceive the gate signals, and the light emitting lines EL receive thelight emitting signals. An additional gate-light emission driving partmay be further disposed to face the gate-light emission driving part GDCshown in FIG. 3A in the second direction DR2.

The second power line E-VSS receives a second voltage, and the secondvoltage may be referred to as a “cathode voltage (or ground voltage)”.Although not shown in figures, the second voltage may be applied to thepixels PX through the second power line E-VSS. The second power lineE-VSS receives a control signal through a corresponding second signalconnection line of the signal connection lines SCL. One end of thesecond signal connection line is connected to the second power lineE-VSS, and the other end of the second signal connection line isconnected to the pad parts PD.

Referring to FIG. 3B, the organic light emitting display panel DPincludes a base substrate SUB, a circuit layer DP-CL disposed on thebase substrate SUB, a light emitting device layer DP-OLED, and a thinfilm encapsulation layer TFE. The base substrate SUB includes at leastone plastic film. The base substrate SUB may be a flexible substrate andmay include a plastic substrate, a glass substrate, a metal substrate,or an organic/inorganic-mixed material substrate.

The circuit layer DP-CL includes a plurality of insulating layers, aplurality of conductive layers, and a semiconductor layer. Theconductive layers of the circuit layer DP-CL may form signal lines or acontrol circuit of the pixel. The light emitting device layer DP-OLEDincludes organic light emitting diodes. The thin film encapsulationlayer TFE encapsulates the light emitting device layer DP-OLED. The thinfilm encapsulation layer TFE includes an inorganic layer and an organiclayer. The thin film encapsulation layer TFE includes at least twoinorganic layers and an organic layer disposed between them. Theinorganic layers protect the light emitting device layer DP-OLED frommoisture and oxygen, and the organic layer protects the light emittingdevice layer DP-OLED from foreign substances, such as dust. Theinorganic layer may include a silicon nitride layer, a siliconoxynitride layer, a silicon oxide layer, a titanium oxide layer, or analuminum oxide layer. The organic layer may include an acryl-basedorganic material, but it should not be limited thereto.

The input sensing unit TS is directly disposed on the thin filmencapsulation layer TFE, but it should not be limited thereto. The inputsensing unit TS includes touch sensors and touch signal lines. Thesensors and the touch signal lines may have either a single-layerstructure or a multi-layer structure.

The touch sensors and the touch signal lines may include indium tinoxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zincoxide (ITZO), PEDOT, a metal nano-wire, and a graphene. The touchsensors and the touch signal lines may include a metal layer, e.g.,molybdenum, silver, titanium, copper, aluminum, or an alloy thereof. Thetouch sensors and the touch signal lines may have the same layerstructure or different layer structures. The touch sensor layer TS willbe described in detail later.

FIG. 4A is an equivalent circuit diagram showing a pixel according to anexemplary embodiment of the present disclosure. FIGS. 4B and 4C arepartially cross-sectional views showing a display panel according to anexemplary embodiment of the present disclosure.

FIG. 4A shows an i-th pixel PXi connected to a k-th data line DLk amongthe data lines DL. FIG. 4B shows a cross-section of the portioncorresponding to a first transistor T1 of the equivalent circuit shownin FIG. 4A, and FIG. 4C shows a cross-section of a portion correspondingto a second transistor T2, a sixth transistor T6, and an organic lightemitting diode OLED of the equivalent circuit shown in FIG. 4A.

Referring to FIG. 4A, the i-th pixel PXi includes an organic lightemitting diode OLED and a pixel driving circuit controlling the organiclight emitting diode OLED. The driving circuit includes seven thin filmtransistors T1 to T7 and one storage capacitor Cst. In the presentexemplary embodiment, the pixel driving circuit includes seventransistors T1 to T7 and one storage capacitor Cst, but the pixel PXimay be sufficient to include the first transistor (or a “drivingtransistor”) T1, the second transistor (or a “switching transistor) T2,and the capacitor Cst as the driving circuit to drive the organic lightemitting diode OLED, and the pixel driving circuit may have variousconfigurations.

The driving transistor controls a driving current applied to the organiclight emitting diode OLED. An output electrode of the second transistorT2 is electrically connected to the organic light emitting diode OLED.The output electrode of the second transistor T2 directly makes contactwith an anode of the organic light emitting diode OLED or is connectedto the anode of the organic light emitting diode OLED via anothertransistor, e.g., the sixth transistor T6.

A control electrode of a control transistor receives a control signal.The control signal applied to the i-th pixel PXi includes an (i−1)thgate signal Si−1, an i-th gate signal Si, an (i+1)th gate signal Si+1, adata signal Dk, and an i-th light emitting control signal Ei. In thepresent exemplary embodiment, the control transistor includes the firsttransistor T1 and third to seventh transistors T3 to T7.

The first transistor T1 includes an input electrode connected to thek-th data line DLk, a control electrode connected to an i-th gate lineGLi, and an output electrode connected to the output electrode of thesecond transistor T2. The first transistor T1 is turned on by the gatesignal Si (hereinafter, referred to as the “i-th gate signal”) appliedto the i-th gate line GLi to provide the data signal Dk applied to thek-th data line to the storage capacitor Cst.

Referring to FIGS. 4B and 4C, the first transistor T1, the secondtransistor T2, and the sixth transistor T6 are disposed on the basesubstrate SUB. The first, second, and sixth transistors T1, T2, and T6have the same structure as each other, and thus the first transistor T1will be described in detail, and details of the second and sixthtransistors T2 and T6 will be omitted.

An upper surface of the base substrate SUB is defined by the firstdirection DR1 and the second direction DR2. The first transistor T1includes a first input electrode DE1, a first output electrode SE1, afirst control electrode GE1, and a first oxide semiconductor patternOSP1.

A buffer layer BFL is disposed on the base substrate SUB. The bufferlayer BFL improves a coupling force between the base substrate SUB andthe conductive patterns or the semiconductor patterns. The buffer layerBFL includes an inorganic layer. Although not shown in the figures, abarrier layer may be further disposed on the base substrate SUB toprevent foreign substances from entering. The buffer layer BFL and thebarrier layer may be selectively disposed or omitted.

The base substrate SUB may include a plastic substrate, a glasssubstrate, or a metal substrate. The plastic substrate includes at leastone of an acryl-based resin, a methacryl-based resin, polyisoprene, avinyl-based resin, an epoxy-based resin, a urethane-based resin, acellulose-based resin, a siloxane-based resin, a polyimide-based resin,a polyamide-based resin, and a perylene-based resin.

The first oxide semiconductor pattern OSP1 is disposed on the bufferlayer BFL. The first oxide semiconductor pattern OSP1 may include indiumtin oxide (ITO), indium gallium zinc oxide (IGZO), zinc oxide (ZnO), orindium zinc oxide (IZO).

A first insulating layer 10 is disposed on the buffer layer BFL to coverthe first oxide semiconductor pattern OSP1.

The first control electrode GE1 is disposed on the first insulatinglayer 10, and a second insulating layer 20 is disposed on the firstinsulating layer 10 to cover the first control electrode GE1. The secondinsulating layer 20 provides a flat upper surface. The second insulatinglayer 20 includes an organic material and/or an inorganic material.

The first insulating layer 10 and the second insulating layer 20 includean inorganic material. The inorganic material includes at least one ofaluminum oxide, titanium oxide, silicon oxide, silicon oxynitride,zirconium oxide, and hafnium oxide

A first contact hole CH1 and a second contact hole CH2 are respectivelydefined through the first and second insulating layers 10 and 20 torespectively expose a first area and a second area of the first oxidesemiconductor pattern OSP1. Each of the first and second contact holesCH1 and CH2 penetrates through the first and second insulating layers 10and 20.

The first input electrode DE1 and the first output electrode SE1 aredisposed on the second insulating layer 20. The first input electrodeDE1 and the first output electrode SE1 are respectively connected to thefirst area and the second area of the first oxide semiconductor patternOSP1 through the first contact hole CH1 and the second contact hole CH2.

A third insulating layer 30 is disposed on the second insulating layer20 to cover the first input electrode DE1 and the first output electrodeSE1. The third insulating layer 30 provides a flat upper surface. Thethird insulating layer 30 includes an organic material and/or aninorganic material. That is, the third insulating layer 30 covers inputelectrodes and output electrodes.

FIG. 4C shows the sixth transistor T6 having substantially the samestructure as the second transistor T2. However, the structure of thesixth transistor T6 may be changed. The sixth transistor T6 includes aninput electrode DE6 connected to the output electrode SE2 of the secondtransistor T2 on the third insulating layer 30.

The organic light emitting diode OLED and a pixel definition layer PDLare disposed on the third insulating layer 30. The anode AE is disposedon the third insulating layer 30. The anode AE is connected to an sixthoutput electrode SE6 of the sixth transistor T6 through a seventhcontact hole CH7 defined through the third insulating layer 30. Thepixel definition layer PDL is provided with an opening OP definedtherethrough. At least a portion of the anode AE is exposed through theopening OP of the pixel definition layer PDL.

The pixel PX is disposed in a pixel area of the organic light emittingdisplay panel DP when viewed in a plan view. The pixel area includes alight emitting area PXA and a non-light emitting area NPXA adjacent tothe light emitting area PXA. The non-light emitting area NPXA isdisposed to surround the light emitting area PXA. In the presentexemplary embodiment, the light emitting area PXA is defined tocorrespond to the anode AE, but it should not be limited thereto. Thelight emitting area PXA may be defined as an area in which a light isgenerated. The light emitting area PXA may be defined to correspond to aportion of the anode AE exposed through the opening OP.

A hole control layer HCL is commonly disposed in the light emitting areaPXA and the non-light emitting area NPXA. Although not shown in figures,a common layer, such as the hole control layer HCL, may be commonlyformed in the pixels PX.

An organic light emitting layer EML is disposed on the hole controllayer HCL. The organic light emitting layer EML is disposed only in anarea corresponding to the opening OP. That is, the organic lightemitting layer EML may be patterned into plural parts, and the parts maybe respectively disposed in the pixels PX.

An electron control layer ECL is disposed on the organic light emittinglayer EML. A cathode CE is disposed on the electron control layer ECL.The cathode CE is commonly disposed in the pixels PX.

The thin film encapsulation layer TFE is disposed on the cathode CE. Thethin film encapsulation layer TFE is commonly disposed in the pixels PX.The thin film encapsulation layer TFE includes at least one inorganiclayer and at least one organic layer. The thin film encapsulation layerTFE may include a plurality of inorganic layers and a plurality oforganic layers alternately stacked with the inorganic layers.

In the present exemplary embodiment, the patterned organic lightemitting layer EML is shown as a representative example, but the organiclight emitting layer EML may be commonly disposed in the pixels PX. Inthis case, the organic light emitting layer EML may generate whitelight. In addition, the organic light emitting layer EML may have amulti-layer structure.

In the present exemplary embodiment, the thin film encapsulation layerTFE directly covers the cathode CE. In the present exemplary embodiment,a capping layer may further be disposed to cover the cathode CE. In thiscase, the thin film encapsulation layer TFE directly covers the cappinglayer.

FIGS. 5A to 5C are cross-sectional views showing a thin filmencapsulation layer according to an exemplary embodiment of the presentdisclosure.

Hereinafter, thin film encapsulation layers TFE1, TFE2, and TFE3 will bedescribed in detail with reference to FIG. 5A to FIG. 5C.

Referring to FIG. 5A, the thin film encapsulation layer TFE1 includes ninorganic thin layers IOL1 to IOLn. The thin film encapsulation layerTFE1 includes n−1 organic thin layers OL1 to OLn−1, and the n−1 organicthin layers OL1 to OLn−1 are alternately arranged with the n inorganicthin layers IOL1 to IOLn. The n−1 organic thin layers OL1 to OLn−1 mayhave a thickness greater than that of the n inorganic thin layers IOL1to IOLn.

Each of the n inorganic thin layers IOL1 to IOLn may have either asingle-layer structure containing one type of material or a multi-layerstructure containing a plurality different types of material. Each ofthe n−1 organic thin layers OL1 to OLn−1 may be formed by depositing,printing, or coating organic monomers. The organic monomers may includean acryl-based monomer.

Referring to FIG. 5B and FIG. 5C, the inorganic thin layers included ineach of the thin film encapsulation layers TFE2 and TFE3 may include thesame inorganic material or different inorganic materials from eachother, and may have the same thickness or different thicknesses. Theorganic thin layers included in each of the thin film encapsulationlayers TFE2 and TFE3 may include the same organic material or differentorganic materials from each other and may have the same thickness ordifferent thicknesses.

As shown in FIG. 5B, the thin film encapsulation layer TFE2 includes thefirst inorganic thin layer IOL1, the first organic thin layer OL1, thesecond inorganic thin layer IOL2, the second organic thin layer OL2, andthe third inorganic thin layer IOL3, which are sequentially stacked.

The first inorganic thin layer IOL1 may have a double-layer structurethat may include, for example, a first sub-layer S1 and a secondsub-layer S2 that include different inorganic materials.

As shown in FIG. 5C, the thin film encapsulation layer TFE3 includes afirst inorganic thin layer IOL10, a first organic thin layer OL1, and asecond inorganic thin layer IOL20, which are sequentially stacked. Thefirst inorganic thin layer IOL10 may have a double-layer structureincluding, for example, a first sub-layer S10 and a second sub-layer S20that may include different inorganic materials. The second inorganicthin layer IOL20 may have a double-layer structure. The second inorganicthin layer IOL20 may include a first sub-layer S100 and a secondsub-layer S200, which are deposited in different environments. The firstsub-layer S100 may be deposited at a relatively low power level, and thesecond sub-layer S200 may be deposited at a relatively high power level.The first and second sub-layers S100 and S200 may include the sameinorganic material.

FIG. 6A is a cross-sectional view showing an input sensing unitaccording to an exemplary embodiment of the present disclosure. FIG. 6Bto FIG. 6E are plan views showing an input sensing unit according to anexemplary embodiment of the present disclosure.

Referring to FIG. 6A, the input sensing unit TS includes a firstconductive layer TS-CL1, a first insulating layer (hereinafter, referredto as a “first touch insulating layer) TS-IL1, a second conductive layerTS-CL2, and a second insulating layer (hereinafter, referred to as a“second touch insulating layer) TS-IL2. The first conductive layerTS-CL1 is directly disposed on the thin film encapsulation layer TFE,but the inventive concept should not be limited thereto. That is,another inorganic layer (e.g., a buffer layer) may be further disposedbetween the first conductive layer TS-CL1 and the thin filmencapsulation layer TFE.

Each of the first conductive layer TS-CL1 and the second conductivelayer TS-CL2 has a single-layer structure or a multi-layer structurehaving a plurality of layers stacked in the third direction DR3. Theconductive layer having the multi-layer structure may include two ormore layers among transparent conductive layers and metal layers. Theconductive layer having the multi-layer structure may include metallayers including different metals from each other. The transparentconductive layer may include indium tin oxide (ITO), indium zinc oxide(IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), PEDOT, a metalnano-wire, or a graphene. The metal layer may include molybdenum,silver, titanium, copper, aluminum, or an alloy thereof.

Each of the first conductive layer TS-CL1 and the second conductivelayer TS-CL2 includes a plurality of patterns. Hereinafter, the firstconductive layer TS-CL1 includes first conductive patterns, and thesecond conductive layer TS-CL2 includes second conductive patterns. Eachof the first and second conductive patterns includes touch electrodesand touch signal lines.

Each of the first touch insulating layer TS-IL1 and the secondconductive layer TS-CL2 includes an inorganic material or an organicmaterial. The inorganic material may include at least one of aluminumoxide, titanium oxide, silicon oxide, silicon nitride, siliconoxynitride, zirconium oxide, and hafnium oxide. The organic material mayinclude at least one of an acryl-based resin, a methacryl-based resin,polyisoprene, a vinyl-based resin, an epoxy-based resin, aurethane-based resin, a cellulose-based resin, a siloxane-based resin, apolyimide-based resin, a polyamide-based resin, and a perylene-basedresin.

Each of the first touch insulating layer TS-IL1 and the second touchinsulating layer TS-IL2 has a single-layer structure or a multi-layerstructure. Each of the first touch insulating layer TS-IL1 and thesecond touch insulating layer TS-IL2 may include at least one of aninorganic layer and an organic layer. The inorganic layer and theorganic layer may be formed by a chemical vapor deposition method.

The first touch insulating layer TS-IL1 should not be limited to aspecific shape if the first touch insulating layer TS-IL1 insulates thefirst conductive layer TS-CL1 and the second conductive layer TS-CL2.The shape of the first touch insulating layer TS-IL1 is determinedaccording to a shape of the first and second conductive patterns. Thefirst touch insulating layer TS-IL1 entirely covers the thin filmencapsulation layer TFE or includes a plurality of insulating patterns.The insulating patterns are overlapped with first connection parts CP1and second connection parts CP2, to be described later.

In the present exemplary embodiment, the two-layer type touch sensorlayer has been described, but the touch sensor layer should not belimited to the two-layer type. A single-layer type touch sensor layermay include a conductive layer and an insulating layer covering theconductive layer. The conductive layer may include touch sensors andtouch signal lines connected to the touch sensors. The single-layer typetouch sensor layer obtains coordinate information using aself-capacitance method.

FIG. 6B to FIG. 6E are plan views showing an input sensing unit TSaccording to an exemplary embodiment of the present disclosure.

Referring to FIG. 6B, the input sensing unit TS may include a pluralityof first touch sensors, a plurality of second touch sensors, a pluralityof connection electrodes, a plurality of touch signal lines, a first padpart PD1, and a second pad part PD2.

The first touch sensors and the second touch sensors are arranged in thedisplay area DA. The touch signal lines, the first pad part PD1, and thesecond pad part PD2 are arranged in the peripheral area NDA. Theconnection electrodes are arranged in the display area DA, but theconnection electrodes may be arranged in the peripheral area NDAaccording to exemplary embodiments.

The first touch sensors extend in the first direction DR1 and arearranged in the second direction DR2. Each of the first touch sensorsmay include a plurality of first sensor parts SP1 and a plurality offirst connection parts CP1 connecting the first sensor parts SP1.

Each of the first sensor parts SP1 and the first connection parts CP1have a mesh shape through which a plurality of mesh openings is defined.The first sensor parts SP1 and the first connection parts CP1 arearranged in the first direction DR1. Each of the first connection partsCP1 connects two first sensor parts SP1 adjacent to each other among thefirst sensor parts SP1.

According to the present exemplary embodiment, a first first touchsensor and a last first touch sensor (hereinafter, referred to as an“n-th first touch sensor”) among the first touch sensors may be disposedsubstantially adjacent to the peripheral area NDA. Here, the “n” denotesa natural number. As shown in FIG. 6B, the first first touch sensor andthe n-th first touch sensor face each other in the second direction DR2and are disposed most adjacent to the peripheral area NDA.

In particular, the first sensor parts included in the first first touchsensor and the n-th first touch sensor may have a shape different fromthat of the first sensor parts included in a second first touch sensorto an (n−1)th first touch sensor. As an example, the first sensor partsincluded in the first first touch sensor and the n-th first touch sensormay have a shape corresponding to a portion of the shape of the firstsensor parts included in the second first touch sensor to the (n−1)thfirst touch sensor.

The second touch sensors extend in the second direction DR2 and arearranged in the first direction DR1. Each of the second touch sensorsincludes a plurality of second sensor parts SP2 and a plurality ofsecond connection parts CP2 connecting the second sensor parts SP2.

Each of the second sensor parts SP2 and the second connection parts CP2have a mesh shape through which a plurality of mesh openings is defined.The second sensor parts SP2 and the second connection parts CP2 arearranged in the second direction DR2. Each of the second connectionparts CP2 connects two second sensor parts SP2 adjacent to each otheramong the second sensor parts SP2.

According to the present exemplary embodiment, a first second touchsensor and a last second touch sensor (hereinafter, referred to as an“m-th second touch sensor”) among the second touch sensors may bedisposed most adjacent to the peripheral area NDA. Here, the “m” denotesa natural number. As shown in FIG. 6B, the first second touch sensor andthe m-th second touch sensor face each other in the first direction DR1and are disposed most adjacent to the peripheral area NDA.

In particular, the second sensor parts included in the first secondtouch sensor and the m-th second touch sensor may have a shape differentfrom that of the second sensor parts included in a second second touchsensor to an (m−1)th second touch sensor. As an example, the secondsensor parts SP2 included in the first second touch sensor and the m-thsecond touch sensor may have a shape corresponding to a portion of theshape of the second sensor parts SP2 included in the second second touchsensor to the (m−1)th second touch sensor.

The first sensor parts SP1 included in the first touch sensors arecapacitively coupled to the second sensor parts SP2 included in thesecond sensor parts SP2. When the touch sensing signals are applied tothe first sensor parts SP1, capacitors are formed between the firstsensor parts SP1 and the second sensor parts SP2.

The connection electrodes include first connection electrodes TSL1 a toTSL1 d and second connection electrodes TSL2 a to TSL2 e.

The first connection electrodes TSL1 a to TSL1 d are arranged in thesecond direction DR2 and are respectively connected to ends of the firsttouch sensors. In detail, a first connection electrode TSL1 a isconnected to the end of a first first touch sensor of the first touchsensors. A second connection electrode TSL1 b is connected to the end ofa second first touch sensor of the first touch sensors. A thirdconnection electrode TSL1 c is connected to the end of a third firsttouch sensor of the first touch sensors. A fourth connection electrodeTSL1 d is connected to the end of a fourth first touch sensor of thefirst touch sensors. As described above, the first connection electrodesTSL1 a to TSL1 d are respectively connected to the ends of the firsttouch sensors to apply electrical signals to the first touch sensors.

The second connection electrodes TSL2 a to TSL2 e are arranged in thefirst direction DR1 and are respectively connected to ends of the secondtouch sensors. In detail, a first connection electrode TSL2 a isconnected to the end of a first second touch sensor of the second touchsensors. A second connection electrode TSL2 b is connected to the end ofa second second touch sensor of the second touch sensors. A thirdconnection electrode TSL2 c is connected to the end of a third secondtouch sensor of the second touch sensors. A fourth connection electrodeTSL2 d is connected to the end of a fourth second touch sensor of thesecond touch sensors. A fifth connection electrode TSL2 e is connectedto the end of a fifth second touch sensor of the second touch sensors.As described above, the second connection electrodes TSL2 a to TSL2 eare respectively connected to the ends of the second touch sensors toapply electrical signals to the second touch sensors.

Meanwhile, among the first connection electrodes TSL1 a to TSL1 d, thefirst to third first connection electrodes TSL1 a to TSL1 c are arrangedin the flat area NBA, and the fourth first connection electrode TSL1 dis arranged in the bending area BA. A structure in which the fourthfirst connection electrode TSL1 d is arranged in the bending area BAwill be described as a representative example, but one or moreconnection electrodes may be disposed in the bending area BA. Accordingto the present exemplary embodiment, one connection electrode isdisposed in the bending area BA.

Referring to FIG. 6B, each of the first connection electrodes TSL1 a toTSL1 d extends in the second direction DR2 substantially perpendicularto the bending axis BX. The display device DD according to the presentdisclosure is bent along the second direction DR2 with respect to thebending axis BX. As a result, the largest stress may be applied to bothends of the fourth first connection electrode TSL1 d disposed in thebending area BA among the first connection electrodes TSL1 a to TSL1 d.Accordingly, a fracture may occur in the fourth first connectionelectrode TSL1 d.

According to the present exemplary embodiment, one edge portion ofopposite edge portions of the fourth first connection electrode TSL1 dmay be inclined with respect to the bending axis BX. When the one edgeportion of the fourth first connection electrode TSL1 d is inclined withrespect to the bending axis BX, the stress applied to the both ends ofthe fourth first connection electrode TSL1 d may be reduced.

Hereinafter, each of the first connection electrodes TSL1 a to TSL1 dand the second connection electrodes TSL2 a to TSL2 e may include acenter portion and opposite edge portions.

As described above, at least one edge portion of opposite edge portionsof the connection electrode disposed in the bending area BA among thefirst connection electrodes TSL1 a to TSL1 d may include the edgeinclined with respect to the bending axis BX.

The touch signal lines include first touch signal lines SPL1 a to SPLand second touch signal lines SPL2 a to SPL2 e. First ends of the firsttouch signal lines SPL1 a to SPL1 d are respectively connected to thefirst connection electrodes TSL1 a to TSL1 d. Second ends of the firsttouch signal lines SPL1 a to SPL1 d are respectively connected to padsincluded in the first pad part PD1. The first touch signal lines SPL1 ato SPL1 d transmit electrical signals output from the first pad part PD1to the first connection electrodes TSL1 a to TSL1 d.

First ends of the second touch signal lines SPL2 a to SPL2 e arerespectively connected to the second connection electrodes TSL2 a toTSL2 e. Second ends of the second touch signal lines SPL2 a to SPL2 eare respectively connected to pads included in the second pad part PD2.The second touch signal lines SPL2 a to SPL2 e transmit electricalsignals output from the second pad part PD2 to the second connectionelectrodes TSL2 a to TSL2 e.

Although not shown in the figures, the first touch signal lines SPL1 ato SPL and the second touch signal lines SPL2 a to SPL2 e may have amesh shape.

According to the present exemplary embodiment, some of the first sensorparts SP1, the first connection parts CP1, the first touch signal linesSPL1 a to SPL1 d, the second sensor parts SP2, the second connectionparts CP2, and the second touch signal lines SPL2 a to SPL2 e are formedby patterning the first conductive layer TS-CL1 shown in FIG. 6A, andthe others of the first sensor parts SP1, the first connection partsCP1, the first touch signal lines SPL1 a to SPL1 d, the second sensorparts SP2, the second connection parts CP2, and the second touch signallines SPL2 a to SPL2 e are formed by patterning the second conductivelayer TS-CL2 shown in FIG. 6A.

To electrically connect conductive patterns disposed on differentlayers, a contact hole may be formed through the first touch insulatinglayer TS-IL1 shown in FIG. 6A. Hereinafter, the input sensing unit TSwill be described with reference to FIG. 6C to FIG. 6E.

Referring to FIG. 6C, the first conductive patterns are disposed on thethin film encapsulation layer TFE. The first conductive patterns includethe second connection parts CP2. The second connection parts CP2 aredirectly disposed on the thin film encapsulation layer TFE. The thinfilm encapsulation layer TFE covers the display area DA.

Referring to FIG. 6D, the first touch insulating layer TS-IL1 isdisposed on the thin film encapsulation layer TFE to cover the secondconnection parts CP2. Contact holes CH are defined through the firsttouch insulating layer TS-IL1 to partially expose the second connectionparts CP2. The contact holes CH are formed by a photolithographyprocess.

Referring to FIG. 6E, the second conductive patterns are disposed on thefirst touch insulating layer TS-IL1. The second conductive patternsinclude the first sensor parts SP1, the first connection parts CP1, thefirst touch signal lines SPL1 a to SPL1 d, the second sensor parts SP2,and the second touch signal lines SPL2 a to SPL2 e. Although not shownseparately, the second touch insulating layer TS-IL2 is disposed on thefirst touch insulating layer TS-IL1 to cover the second conductivepatterns.

In addition, according to another exemplary embodiment of the presentdisclosure, the first conductive patterns and the second conductivepatterns may be changed with respect to each other. That is, the secondconductive patterns may include the second connection parts CP2.

FIG. 7A is an enlarged view showing an area AA shown in FIG. 6Eaccording to an exemplary embodiment of the present disclosure. FIG. 7Bis an enlarged view showing a sensor pattern shown in FIG. 7A accordingto an exemplary embodiment of the present disclosure. FIG. 7C is anenlarged view showing an area BB shown in FIG. 6E according to anexemplary embodiment of the present disclosure. FIG. 7D is an enlargedview showing an area AX1 shown in FIG. 7C. FIG. 7E is an enlarged viewshowing an area AX2 shown in FIG. 7C according to an exemplaryembodiment of the present disclosure. FIG. 7F is an enlarged viewshowing an area AX2 shown in FIG. 7C according to an exemplaryembodiment of the present disclosure. FIGS. 7G and 7H are enlarged viewsshowing an area BB shown in FIG. 6E according to an exemplary embodimentof the present disclosure.

Referring to FIG. 7A, each of the first touch sensors and the secondtouch sensors shown in FIG. 6B include a plurality of mesh lines SPt1 todefine a plurality of mesh openings TS-OP. Each mesh line SPt1 includestwo first extension parts SPt1-A extending in a fifth direction DR5crossing the first direction DR1 and the second direction DR2 and twosecond extension parts SPt1-B extending in a sixth direction DR6crossing the fifth direction DR5. The first extension parts SPt1-A faceeach other and are connected to the second extension parts SPt1-B. Thesecond extension parts SPt1-B face each other and are connected to thefirst extension parts SPt1-A. Each mesh line has a line width of a fewmicrometers.

Meanwhile, the mesh openings TS-OP correspond to the light emittingareas PXA in a one-to-one correspondence, but they should not be limitedthereto or thereby. That is, one mesh opening TS-OP may correspond totwo or more light emitting areas PXA.

According to the present exemplary embodiment, the mesh openings TS-OPinclude first mesh openings TS-OP1 each having a first area and secondmesh openings TS-OP2 each having a second area different from the firstarea.

The light emitting areas PXA may have various sizes. For instance, amongthe light emitting areas PXA, the size of the light emitting areas PXAemitting a first light may be different from the size of the lightemitting areas PXA emitting a second light. As an example, the lightemitting areas PXA emitting the first light, the light emitting areasPXA emitting the second light, and the light emitting areas PXA emittingthe third light may have different sizes from each other.

However, each of the light emitting areas PXA may have the same size,and each of the mesh openings TS-OP may have the same size.

FIG. 7B shows one mesh line among the mesh lines SPt1. Referring to FIG.7B, the mesh line SPt1 includes a first mesh line ML1 and a second meshlines ML2, which correspond to the first extension parts SPt1-A. Themesh line SPt1 also includes a third mesh line ML3 and a fourth meshline ML4, which correspond to the second extension parts SPt1-B.

One end of the first mesh line ML1 is connected to one end of the thirdmesh line ML3, and the other end of the first mesh line ML1 is connectedto one end of the fourth mesh line ML4. One end of the second mesh lineML2 is connected to the other end of the third mesh line ML3, and theother end of the second mesh line ML2 is connected to the other end ofthe fourth mesh line ML4.

According to the present exemplary embodiment, an inner line IML of themesh line SPt1 may be inclined with respect to the bending axis BX.Here, the inner line IML may be an inner edge of the mesh line SPt1defining the mesh opening TS-OP. That is, since the inner line IML isinclined with respect to the bending axis BX, the mesh line SPt1 mayhave the shape inclined with respective to the bending axis BX. As aresult, stress applied to the mesh line SPt1 in the bending area BA maybe reduced.

FIG. 7C shows a connection electrode according to an exemplaryembodiment of the present disclosure. The connection electrode shown inFIG. 7C may be substantially the same as the fourth connection electrodeTSL1 d shown in FIG. 6B. Hereinafter, for the convenience ofexplanation, the fourth connection electrode TSL1 d will be described asthe connection electrode TSL1 d.

The connection electrode TSL1 d includes a center portion TAa, a firstedge portion TAb, and a second edge portion TAc. The center portion TAamakes contact with the one end of the first touch sensor disposed in thebending area BA among the first touch sensors. The first edge portionTAb is connected to one end of the center portion TAa. The second edgeportion TAc is connected to the other end of the center portion TAa.

Referring to FIG. 7D, the first edge portion TAb according to thepresent exemplary embodiment includes a first edge Ed1 a vertical to thebending axis BX and a second edge Ed1 b inclined with the bending axisBX. That is, the first edge Ed1 a is substantially parallel to thesecond direction DR2 and connected to the one end of the first touchsensor disposed in the bending area BA among the first touch sensors.The second edge Ed1 b is connected to the first edge Ed1 a and thecenter portion TAa.

Referring to FIG. 7E, the second edge portion TAc according to thepresent exemplary embodiment includes a third edge Ed2 a vertical to thebending axis BX and a fourth edge Ed2 b inclined with the bending axisBA. That is, the third edge Ed2 a is substantially parallel to thesecond direction DR2 and connected to the one end of the first touchsensor disposed in the bending area BX among the first touch sensors.The fourth edge Ed2 b is connected to the third edge Ed2 a and thecenter portion TAa.

In addition, according to the present exemplary embodiment, the firstedge portion TAb and the second edge portion TAc may be symmetrical witheach other with respect to the center portion TAa, but they should notbe limited thereto. That is, the first edge portion TAb and the secondedge portion TAc may have different shapes from each other. As anexample, the first edge portion of the connection electrode is disposedin the flat area NBA, and the second edge portion of the connectionelectrode is disposed in the bending area BA. In this case, the shape ofthe first edge portion disposed in the flat area NBA may be differentfrom the shape of the second edge portion disposed in the bending areaBA.

Further, according to the present exemplary embodiment, a slope of thesecond edge Ed1 b with respect to the bending axis BX may be equal to aslope of the second mesh line ML2 shown in FIG. 7B. A slope of thefourth edge Ed2 b with respect to the bending axis BX may be equal to aslope of the third mesh line ML3 shown in FIG. 7B.

FIG. 7F shows one edge portion of opposite edge portions of a connectionelectrode according to another exemplary embodiment of the presentdisclosure.

Referring to FIG. 7F, a third edge Ed2 c is substantially parallel tothe second direction DR2 and connected to a fourth edge Ed2 d and acenter portion TAa. A fourth edge Ed2 d is inclined with respect to thebending axis BX and connected to the third edge Ed2 c and the centerportion TAa. In this case, each of the third and fourth edges Ed2 c andEd2 d is spaced apart from the one end of the first touch sensor.

A first end of the third edge Ed2 c is connected to a first end of thefourth edge Ed2 d, and a second end of the third edge Ed2 c is connectedto the center portion TAa. A second end of the fourth edge Ed2 d isconnected to the center portion TAa, and a first end of the fourth edgeEd2 d is connected to the third edge Ed2 c.

FIGS. 7G and 7H show a connection electrode different from theconnection electrode TSL1 d shown in FIG. 7C. The connection electrodeTSL1 d shown in FIGS. 7G and 7H may have substantially the samestructure as the connection electrode TSL1 d shown in FIG. 7C except forshapes of the first and second edge portions TAb and TAc. Accordingly,the shapes of the first and second edge portions will be described indetail with reference to FIGS. 7G and 7H.

Referring to FIG. 7G, the connection electrode TSL1 d includes a centerportion TA2 a, a first edge portion TA2 b, and a second edge portion TA2c.

According to the present exemplary embodiment, the first edge portionTA2 b includes a fifth edge Ed3 a and a sixth edge Ed3 b. The secondedge portion TA2 c includes a seventh edge Ed4 a and an eighth edge Ed4b.

In particular, the fifth and sixth edges Ed3 a and Ed3 b may be inclinedwith respect to the bending axis BX. That is, one end of the fifth edgeEd3 a is connected to one end of the sixth edge Ed3 b, and the other endof the fifth edge Ed3 a is connected to the center portion TA2 a. Oneend of the sixth edge Ed3 b is connected to the one end of the fifthedge Ed3 a, and the other end of the sixth edge Ed3 b is connected tothe center portion TA2 a.

As described above, since the one end of the fifth edge Ed3 a isconnected to the one end of the sixth edge Ed3 b, each of the fifth edgeEd3 a and the sixth edge Ed3 b is spaced apart from the one end of thefirst touch sensor and inclined with respect to the bending axis BX.

In addition, the seventh and eighth edges Ed4 a and Ed4 b may beinclined with respect to the bending axis BX. That is, one end of theseventh edge Ed4 a is connected to one end of the eighth edge Ed4 b, andthe other end of the seventh edge Ed4 a is connected to the centerportion TA2 a. One end of the eighth edge Ed4 b is connected to the oneend of the seventh edge Ed4 a, and the other end of the eighth edge Ed4b is connected to the center portion TA2 a.

As described above, since the one end of the seventh edge Ed4 a isconnected to the one end of the eighth edge Ed4 b, each of the seventhedge Ed4 a and the eighth edge Ed4 b is spaced apart from the one end ofthe first touch sensor and inclined with respect to the bending axis BX.

Referring to FIG. 7H, the connection electrode TSL1 d includes a centerportion TA3 a, a first edge portion TA3 b, and a second edge portion TA3c.

The first edge portion TA3 b includes a ninth edge Ed5 a, a tenth edgeEd5 b, and an eleventh edge Ed5 c. The eleventh edge Ed5 c connects theninth edge Ed5 a and the tenth edge Ed5 b.

According to the present exemplary embodiment, the ninth and tenth edgesEd5 a and Ed5 b may be inclined with respect to the bending axis BX, andthe eleventh edge Ed5 c may be parallel to the bending axis BX. However,the eleventh edge Ed5 c may be inclined with respect to the bending axisBX according to another embodiment. That is, since the ninth to eleventhedges Ed5 a to Ed5 c according to the present exemplary embodiment arenot vertical to the bending axis BX, the stress applied to the ninth toeleventh edges Ed5 a to Ed5 c in the bending area BA may be reduced.

The second edge portion TA3 c includes a twelfth edge Ed6 a, athirteenth edge Ed6 b, and a fourteenth edge Ed6 c. The fourteenth edgeEd6 c connects the twelfth edge Ed6 a and the thirteenth edge Ed6 b.

According to the present exemplary embodiment, the twelfth andthirteenth edges Ed6 a and Ed6 b may be inclined with respect to thebending axis BX, and the fourteenth edge Ed6 c may be parallel to thebending axis BX. However, the fourteenth edge Ed6 c may be inclined withrespect to the bending axis BX according to another embodiment. That is,since the twelfth to fourteenth edges Ed6 a to Ed6 c according to thepresent exemplary embodiment are not vertical to the bending axis BX,the stress applied to the twelfth to fourteenth edges Ed6 a to Ed6 c inthe bending area BA may be reduced.

As described above, the edge portions of the connection electrodedisposed in the bending area BA include the edge inclined with respectto the bending axis BX. Accordingly, the stress applied to the edgeportions of the connection electrode is reduced, a fracture, which mayresult from the bending of the display device DD, may be prevented fromoccurring in opposite ends of the connection electrode.

However, the shapes of the edge portions of the connection electrodeshould not be limited to those described with reference to FIG. 7C toFIG. 7H. That is, the shapes of the edge portions of the connectionelectrode may be changed in various ways with respect to the bendingaxis BX in the bending area BA.

In addition, as an example, one edge portion of the edge portions of theconnection electrode has the shape shown in FIG. 7D, and the other edgeportion of the edge portions of the connection electrode has the shapeshown in FIG. 7F. That is, the edge portions of the connection electrodemay be provided in various shapes.

FIG. 8A is a plan view showing an input sensing unit TS2 according toanother exemplary embodiment of the present disclosure, and FIG. 8B isan enlarged view showing an area CC shown in FIG. 8A according to anexemplary embodiment of the present disclosure.

The input sensing unit TS2 shown in FIG. 8A has the same structure andfunction as those of the input sensing unit TS1 shown in FIG. 6B exceptfor the structure of the touch signal lines. Accordingly, the touchsignal lines will be described in detail, and the others will beomitted.

Referring to FIGS. 8A and 8B, portions of touch signal lines disposed inthe bending area BA among first touch signal lines SPL1 a to SPL1 d andsecond touch signal lines SPL2 a to SPL2 e may be inclined with respectto the bending axis BX.

In detail, as shown in FIG. 8A, touch signal lines extending in thesecond direction DR2 perpendicular to the bending axis BX are disposedin the flat area NBA. In this case, since the flat area NBA is not bent,stress is not applied to the touch signal lines. On the contrary, in thecase that the touch signal lines extending in the second direction DR2are disposed in the bending area BA, stress may be applied to the touchsignal lines.

Hereinafter, a structure in which the first first touch signal line SPL1a and the second touch signal lines are disposed in the bending area BAwill be described. However, the structure in which the touch signallines are disposed in the bending area BA may be changed in various waysdepending on the connection structure of the connection electrodes.

According to the present exemplary embodiment, the touch signal linedisposed in the bending area BA among the touch signal lines may beinclined with respect to the bending axis BX. As an example, a portionof the first first touch signal lines SPL1 a disposed in the flat areaNBA extends along the second direction DR2. In this case, stress is notapplied to the first touch signal lines SPL1 a.

The portion of the first first touch signal lines SPL1 a disposed in thebending area BA is inclined with respect to the bending axis BX andconnected to the connection electrode disposed in the bending area BAamong the first connection electrodes.

In particular, as shown in FIG. 8B, the touch signal lines disposed inthe bending area BA among the touch signal lines includes an inclinationportion CV inclined with respect to the bending axis BX and a parallelportion PV parallel to the bending axis BX.

As described above, the touch signal lines according to the presentdisclosure are inclined with respect to or parallel to the bending axisBX in the bending area BA, and thus, an intensity of the stress appliedto the touch signal lines may be reduced.

FIG. 9 is a plan view showing an input sensing unit TS3 according toanother exemplary embodiment of the present disclosure.

The input sensing unit TS3 shown in FIG. 9 has the same structure andfunction as those of the input sensing unit TS shown in FIG. 6B exceptfor structures of touch signal lines and connection electrodes.Accordingly, the structures of the touch signal lines and the connectionelectrodes will be described in detail, and details of the others willbe omitted.

Referring to FIG. 9, the connection electrodes are connected to one endsand the other ends of the first touch sensors. In detail, firstconnection electrodes TSL1 are respectively connected to the one ends ofthe first touch sensors, and second connection electrodes TSL2 arerespectively connected to the other ends of the first touch sensors.Third connection electrodes TSL3 are respectively connected to the oneends of the second touch sensors, and fourth connection electrodes TSL4are respectively connected to the other ends of the second touchsensors.

The first touch signal lines are connected to a first pad part PDs1 andthe first connection electrodes TSL1 to apply an electrical signaloutput from the first pad part PDs1 to the first connection electrodeTSL1. The second touch signal lines are connected to a second pad partPDs2 and the second connection electrodes TSL2 to apply an electricalsignal output from the second pad part PDs2 to the second connectionelectrode TSL2. The third touch signal lines are connected to a thirdpad part PDs3 and the third connection electrodes TSL3 to apply anelectrical signal output from the third pad part PDs3 to the thirdconnection electrode TSL3. The fourth touch signal lines are connectedto a fourth pad part PDs4 and the fourth connection electrodes TSL4 toapply an electrical signal output from the fourth pad part PDs4 to thefourth connection electrode TSL4.

As described with reference to FIG. 8B, the first to fourth touch signallines disposed in the bending area BA may include an inclination portionCV inclined with respect to the bending axis BX and a parallel portionPV parallel to the bending axis BX.

Although certain exemplary embodiments and implementations have beendescribed herein, other embodiments and modifications will be apparentfrom this description. Accordingly, the inventive concept is not limitedto such embodiments, but rather to the broader scope of the presentedclaims and various obvious modifications and equivalent arrangements.

What is claimed is:
 1. A display device comprising: a base layer; abuffer layer disposed on the base layer; a display element layerdisposed on the buffer layer and comprising a plurality of pixels, eachof the pixels comprising an anode electrode, a cathode electrode, and alight emitting layer between the anode electrode and the cathodeelectrode; an encapsulation layer disposed on the display element layerand covering the pixels; a plurality of touch sensors disposed directlyon the encapsulation layer, each of the touch sensors comprising aplurality of conductive patterns having a mesh shape; and a plurality ofsignal lines respectively connected to the touch sensors, and wherein:the conductive patterns comprise a plurality of mesh lines defining aplurality of mesh openings; and each of interior angles of one of themesh openings is greater than 90 degrees.
 2. The display device of claim1, wherein the base layer comprising a bending area configured to bendabout a bending axis.
 3. The display device of claim 2, wherein innerlines defining the one of the mesh openings are inclined with respect tothe bending axis.
 4. The display device of claim 3, wherein the one ofthe mesh openings comprises at least four of the inner lines.
 5. Thedisplay device of claim 2, wherein each of signal lines disposed on thebending area among the signal lines comprises inclined portions withrespect to the bending axis.
 6. The display device of claim 5, wherein,for the signal lines disposed on the bending area, the farther from thetouch sensors, the more inclined portions.
 7. The display device ofclaim 2, further comprising a connection electrode disposed between oneof the signal lines and one of the conductive patterns, and theconnection electrode is connected to the mesh lines, wherein theconnection electrode comprises an edge inclined with respect to thebending axis.
 8. The display device of claim 1, wherein two of the meshopenings adjacent to each other have different shapes from each other.9. The display device of claim 1, wherein two of the mesh openingsadjacent to each other have different areas from each other.
 10. Adisplay device comprising: a base layer a buffer layer disposed on thebase layer; a display element layer disposed on the buffer layer andcomprising a plurality of pixels, each of the pixels comprising an anodeelectrode, a cathode electrode, and a light emitting layer between theanode electrode and the cathode electrode; an encapsulation layerdisposed on the display element layer and covering the pixels; aplurality of touch sensors disposed directly on the encapsulation layer,each of the touch sensors comprising a plurality of mesh lines defininga plurality of mesh openings; and a plurality of signal linesrespectively connected to the touch sensors, wherein two of the meshopenings adjacent to each other have different areas from each other.